http://www.thinq.co.uk/2011/1/24/new-nanotape-tech-promises-cooler-chips/
"The new material promises a lot: featuring a thermal conductivity comparable to copper but a flexibility and ability to expand and contract as a result of temperature changes without breaking that is more like a foam, its creators believe that it could be a major breakthrough in the race to create ever-smaller and ever-faster devices."
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